| Project Information
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This project has received funding from the ECSEL Joint Undertaking under grant agreement No 737465. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Germany, Belgium, Ireland. |
Micro-Transfer-Printing of Functional Components on Wafer Level
Watch this short video to understand the main goal of the MICROPRINCE project.
The MICROPRINCE project is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (μTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transferred to target wafer to demonstrate the capabilities of the technology.
